年度 2015
論文名稱

C. H. Chiang, Y. C. Hu, K. H. Chen, C. T. Chiu, C. T. Chuang, W. Hwang, J.-C. Chiou, H. M. Tong, K. N. Chen, Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration, The 7th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.

發表日期 2015-06-12