年度 2015
論文名稱
Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-TsungChiu, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Ho-Ming Tong, and Kuan-Neng Chen* “Novel Cu-to-Cu Bonding with Ti Passivation at 180°C in 3D Integration,”IEEE Electron Device Letters, 34(12), Dec. 2013, pp.1551-1553.(SCI, IF:2.789,Ranking: Top2微電子領域)
發表日期 2015-06-12