Research Projects |
2019 |
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2019.08 ~ 2021.07 |
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Research Projects |
2018 |
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2018.08 ~ 2019.07 |
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Industrial Collaboration |
2017 |
Electronic system-level exploration of power/performance impacts of software/hardware architectural decisions (III) |
Lee, Yu-Min |
Principal Investigator |
2017.01 ~ 2017.12 |
ITRI |
Industrial Collaboration |
2017 |
Thermal Modeling and Analysisfor Handheld Devices |
Lee, Yu-Min |
Principal Investigator |
2017.01 ~ 2017.12 |
MediaTek Inc. |
Research Projects |
2016 |
Yield-Driven Redundant Power Pad Assignment for On-Chip Power Network |
Lee, Yu-Min |
Principal Investigator |
2016.08 ~ 2017.07 |
MOST |
Industrial Collaboration |
2016 |
Electronic system-level exploration of power/performance impacts of software/hardware architectural decisions (II) |
Lee, Yu-Min |
Principal Investigator |
2016.01 ~ 2016.12 |
ITRI |
Industrial Collaboration |
2016 |
Thermal Modeling and Analysis for Handheld Devices (II) |
Lee, Yu-Min |
Principal Investigator |
2015.08 ~ 2016.12 |
MediaTek Inc. |
Industrial Collaboration |
2015 |
Electronic system-level exploration of power/performance impacts of software/hardware architectural decisions (I) |
Lee, Yu-Min |
Principal Investigator |
2015.01 ~ 2016.12 |
ITRI |
Industrial Collaboration |
2014 |
Thermal Modeling and Analysis for Handheld Devices (I) |
Lee, Yu-Min |
Principal Investigator |
2014.08 ~ 2015.07 |
MediaTek Inc. |
Research Projects |
2014 |
3-D Power Delivery Network Diagnosis and Treatment Techniques |
Lee, Yu-Min |
Principal Investigator |
2014.08 ~ 2015.07 |
MOST |
Research Projects |
2013 |
3-D IC Thermal Analysis with Considering Advanced Thermal Dissipation Techniques |
Lee, Yu-Min |
Principal Investigator |
2013.08 ~ 2014.07 |
MOST |
Industrial Collaboration |
2013 |
3-D Power Network Diagnosis Technique |
Lee, Yu-Min |
Principal investigator |
2013.01 ~ 2013.12 |
ITRI |
Industrial Collaboration |
2013 |
Prediction in Package Warpage |
Lee, Yu-Min |
Principal Investigator |
2012.09 ~ 2013.08 |
SPIL |
Research Projects |
2012 |
Parallel computing compatible thermal analysis techniques for 3D ICs (II) |
Lee, Yu-Min |
Principal Investigator |
2012.08 ~ 2013.07 |
NSC |
Industrial Collaboration |
2012 |
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2012.02 ~ 2012.11 |
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Industrial Collaboration |
2012 |
Thermal Modeling and Analysis Techniques |
Lee, Yu-Min |
Principal Investigator |
2012.01 ~ 2012.12 |
ITRI |
Industrial Collaboration |
2012 |
3-D IC Power Delivery Network Design |
Lee, Yu-Min |
Principal Investigator |
2012.01 ~ 2012.12 |
ITRI |
Research Projects |
2011 |
Parallel computing compatible thermal analysis techniques for 3D ICs (I) |
Lee, Yu-Min |
Principal Investigator |
2011.08 ~ 2012.07 |
NSC |
Industrial Collaboration |
2011 |
3-D IC Power Delivery Network Design |
Lee, Yu-Min |
Principal Investigator |
2011.01 ~ 2011.12 |
ITRI |
Industrial Collaboration |
2011 |
Design Automation Flow and Environment Compatible Thermal Analysis Technique |
Lee, Yu-Min |
Principal Investigator |
2011.01 ~ 2011.12 |
ITRI |
Research Projects |
2010 |
Stochastic Electro-Thermal Simulation for 3-D ICs and Its Application to 3-D IC Power Optimization (2/2) |
Lee, Yu-Min |
Principal Investigator |
2010.08 ~ 2011.07 |
NSC |
Industrial Collaboration |
2010 |
Efficiently Thermal Approximation of 3D ICs with Considering TSV/TTSV Effects |
Lee, Yu-Min |
Principal Investigator |
2010.01 ~ 2010.12 |
ITRI |
Research Projects |
2009 |
Stochastic Electro-Thermal Simulation for 3-D ICs and Its Application to 3-D IC Power Optimization (1/2) |
Lee, Yu-Min |
Principal Investigator |
2009.08 ~ 2010.07 |
NSC |
Research Projects |
2008 |
Process Variations Aware Interconnect Modeling, Timing Analysis and Optimization (3/3) |
Yu-Min Lee |
Principal Investigator |
2008.08 ~ 2009.07 |
NSC |
Industrial Collaboration |
2008 |
Net Delay Analysis |
Lee, Yu-Min |
Principal Investigator |
2008.07 ~ 2009.07 |
SpringSoft Inc. |
Research Projects |
2007 |
Process Vaariations Aware Interconnect Modeling, Timing Analysis and Optimization |
Yu-Min Lee |
Principal Investigator |
2007.08 ~ 2008.07 |
NSC |
Research Projects |
2007 |
Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs |
Yu-Min Lee |
Principal Investigator |
2007.08 ~ 2008.07 |
NSC |
Research Projects |
2006 |
Process Variations Aware Interconnect Modeling, Timing Analysis and Optimization (1/3) |
Yu-Min Lee |
Principal Investigator |
2006.08 ~ 2007.07 |
NSC |
Research Projects |
2006 |
Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs (2/3) |
Yu-Min Lee |
Principal Investigator |
2006.08 ~ 2007.07 |
NSC |
Research Projects |
2005 |
Compact Thermal Modeling and Efficient Thermal Simulation for Hot Spots Verifications of Modern IC Designs (1/3) |
Yu-Min Lee |
Principal Investigator |
2005.08 ~ 2006.07 |
NSC |
Research Projects |
2005 |
Power Delivery Network Analysis with Hierarchical Model Order Reduction Techniques (3/3) |
Yu-Min Lee |
Principal Investigator |
2005.08 ~ 2006.07 |
NSC |
Research Projects |
2004 |
Power Delivery Network Analysis with Hierarchical Model Order Reduction Techniques (2/3) |
Yu-Min Lee |
Principal Investigator |
2004.08 ~ 2005.07 |
NSC |
Research Projects |
2003 |
Power Delivery Network Analysis with Hierarchical Model Order Reduction Techniques (1/3) |
Yu-Min Lee |
Principal Investigator |
2003.11 ~ 2004.07 |
NSC |