2023 |
Chiplet placement for 2.5D IC with sequence pair based tree and thermal consideration, to appear in Asia South Pacific Design Automation Conference (ASPDAC 2023), Jan. 16-19, 2023, Japan |
2022 |
Chih-Cheng Chang, Hong-Wen Chiou, and Yu-Min Lee, An approximated model of Boltzmann transport equation for nano-scale thermal analysis, The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Jun. 01-03, 2022, San Diego, CA USA |
2022 |
, 2022 |
2021 |
, Jun. 2021 |
2021 |
Yu-Min Lee, Wen-Sheng Lo, Hong-Wen Chiou, and Shih-Chieh Hsu, DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), Jun. 01-04, 2021, USA |
2021 |
Guan-Jia Chen, Hong-Wen Ciou, Yu-Teng Chang, Yu-Min Lee
, Thermal Pad Design Flow for Automotive Electronics, IEEE International Conference on Consumer Electronics - Taiwan (IEEE 2021 ICCE-TW), Jun. 16-18, 2021, Penghu Taiwan |
2021 |
, 2021 |
2021 |
, 2021 |
2021 |
, 2021 |
2021 |
, 2021 |