Conference Paper
Year Paper Title
2023 Chiplet placement for 2.5D IC with sequence pair based tree and thermal consideration, to appear in Asia South Pacific Design Automation Conference (ASPDAC 2023), Jan. 16-19, 2023, Japan
2022 Chih-Cheng Chang, Hong-Wen Chiou, and Yu-Min Lee, An approximated model of Boltzmann transport equation for nano-scale thermal analysis, The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Jun. 01-03, 2022, San Diego, CA USA
2022 , 2022
2021 , Jun. 2021
2021 Yu-Min Lee, Wen-Sheng Lo, Hong-Wen Chiou, and Shih-Chieh Hsu, DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), Jun. 01-04, 2021, USA
2021 Guan-Jia Chen, Hong-Wen Ciou, Yu-Teng Chang, Yu-Min Lee
 , Thermal Pad Design Flow for Automotive Electronics, IEEE International Conference on Consumer Electronics - Taiwan (IEEE 2021 ICCE-TW), Jun. 16-18, 2021, Penghu Taiwan
2021 , 2021
2021 , 2021
2021 , 2021
2021 , 2021