Electrical Engineering, NCTU

[1]  F.Masuoka, M.Momodomi, Y.Iwata, and R.Shirora, “New Ultra High Density EPROM and Flash EEPROM with NAND Structured Cell,” in IEDM Tech. Dig., pp.552-555, Dec. 1987.

[2]  M.Momodomi, R.Kirisawa, R.Nakayama, S.Aritome, T.Endoh, Y.Itoh, Y.Iwata, H.Oodaira, T.Tanaka, M.Chiba, R.Shirota, and F.Masuoka, “New device technologies for 5V-only 4Mb EE-PROM with NAND structure cell,” in IEDM Tech. Dig., pp.412-415, Dec. 1988.

[3]  R.Shirota, T.Endo, M.Momodomi, R.Nakayama, S.Inoue, R.Kirisawa, and F.Masuoka, “An accurate model of subbreakdown due to Band-to-Band tunneling and its application,” in IEDM Tech. Dig., pp.26-29, Dec. 1988.

[4]  T.Endo, R.Shirota, Y.Tanaka, R.Nakayama, R.Kirisawa, S.Aritome, and F.Masuoka, “New design technology for EEPROM memory cells with 10 million write/erase cycling endurance,” in IEDM Tech. Dig., pp.599-602, Dec. 1989.

[5]  R.Shirota, R.Nakayama, R.Kirisawa, M.Momodomi, K.Sakui, Y.Itoh, S.Aritome, T.Endoh, F.Hatori, and F.Masuoka, "A 2.3 m2 Memory Cell Structure for 16 Mb NAND EEPROM’s," in IEDM Tech. Dig., pp. 103-106, Dec. 1990.

[6]  S.Aritome, R.Shirota, R.Kirisawa, T.Endoh, R.Nakayama, K.Sakui, and F.Masuoka, “A reliable bi-polarity write/erase technology in Flash EEPROMs,” in IEDM Tech. Dig., pp.111-114, Dec. 1990.

[7]  R.Shirota, T.Yamaguchi, “A New Analytical Model for low Voltage Hot Electron Taking Auger Recombination as well as phonon Scattering Process into Account,” in IEDM Tech. Dig. pp.123-126. 1991.

[8]  S.Aritome, S.Satoh, T.Maruyama, H.Watanabe, S.Shuto, G.J.Hemink, R.Shirota, S.Watanabe, and F.Masuoka, "A 0.67m2 Self-Aligned Shallow Trench Isolation Cell (SA-STI-Cell) for 3V-only 256Mbit NAND EEPROM’s," in IEDM Tech. Dig., pp. 61-64, Dec. 1994.

[9]  S.Aritome, Y.Takeuchi, S.Sato, H.Watanabe, K.Shimizu, G.J.Hemink, and R.Shirota, “A novel side-wall transfer-transistor cell (SWATT cell) for multi-level NAND EEPROM’s,” in IEDM Tech. Dig., pp.275-278, Dec. 1995.

[10] S.Satoh, H.Hagiwara, T.Tanzawa, K.Takeuchi, and R.Shirota, "A Novel Isolation-Scaling Technology for NAND EEPROMs with the Minimized Program Disturbance," in IEDM Tech. Dig., pp. 291-294, Dec. 1997.

[11] A.Goda, W.Moriyama, H.Hazama, H.Iizuka, K.Shimizu, S.Aritome and R.Shirota, “A Novel Surface-Oxidized Barrier-SiN Cell Technology to improve Endurance and Read-Disturb Characteristics for Gigabit NAND Flash Memories.” In IEDM Tech. Dig., pp.771-774, Dec. 2000.

[12] F.Arai, S.Satoh, T.Yaegashi, E.Kamiya, Y.Matunaga, Y.Takeuchi, H.Kamata, A.Shimizu, N.Ohtani, N.Kai, S.Takahashi, W.Moriyama, K.Kugimiya, S.Miyazaki, T.Hirose, H.Meguro, K.Hatakeyama, K.Shimizu, R.Shiorta, “High Density(4.4F²) NAND Flash technology Using Super-Shallow Channel Profile(SSCP) engineering.” In IEDM tech. Dig., pp775-778, Dec. 2000. 

 

[13] Y.Itoh, M.Momodomi, R.Shirota, Y.Iwata, R.Nakayama, R.Kirisawa, T.Tanaka, K.Toita, S.Inoue, and F.Masuoka, “An Experimental 4Mb CMOS EEPROM with a NAND Structured Cell,” in ISSCC Dig. Tech. Papers, pp.134-135, Feb. 1989.

[14] K.Imamiya, Y.Sugiura, H.Nakamura, T.Himeno, K.Takeuchi, T.Ikehashi, K.Kanda, K.Hosono, R.Shirota, S.Aritome, K.Shimizu, K.Hatakeyama, and K.Sakui, “A 130mm2 256Mb NAND Flash with Shallow Trench Isolation Technology,” in ISSCC Dig. Tech. Papers, pp.112-113, Feb. 1999.

[15] H.Nakamura, K.Imamiya, T.Himeno, T.Yamamura, T.Ikehashi, K.Takeuchi, M. Kanda, K.Hosono, T.Futatsuyama, K.Kawai, R.Shirota, N.Arai, F.Arai, K.Hatakeyama, H.Hazama, M.Saito, H.Meguro, K.Conley, K.Quader, Chen.Jian , “A 125mm² 1Gb NAND flash memory with 10MB/s program throughput “ in ISSCC, Dig. Tech. Parers, pp.82-411, Feb. 2002

 

[16] R.Shirota, Y.Itoh, R.Nakayama, M.Momodomi, S.Inoue, R.Kirisawa, Y.Iwata, M.Chiba, and F.Masuoka, “A new NAND cell for ultra high density 5V only EEPROMs,” in Symp. VLSI Technology Dig. Tech. Papers, pp.33-34, June 1988.

[17] R.Kirisawa, S.Aritome, R.Nakayama, T.Endoh, R.Shirota, and F.Masuoka, "A NAND Structured Cell with a New Programming Technology for High Reliable 5 V-Only Flash EEPROM," in Symp. VLSI Technology Dig. Tech. Papers, pp.129-130, June 1990.

[18] H.Watanabe, S.Aritome, G.J.Hemink, T.Maruyama, R.Shirota, “Sacling of tunnel oxide thickness for Flash EEPROMs Realizing Stress-Induced Leakage Current Reduction”, in Symp. VLSI Technology Dig. Tech. Papers, pp.47-45, June, 1994.

[19] H.G.Hemink, T.Tanaka, T.Endoh, S.Aritome, and R.Shirota, “Fast and accurate programming method for multilevel NAND flash EEPROM’s,” in Symp. VLSI Technology Dig. Tech. Papers, pp.129-130, June 1995.

[20] S.Satoh, K.Shimizu, T.Tanaka, F.Arai, S.Aritome, and R.Shirota, “A novel Channel Boost Capacitance (CBC) cell technology with low program disturbance suitable for fast programming 4Gbit NAND Flash memories,” in Symp. VLSI Technologies Dig. Tech. Papers, pp.108-109, June 1998.

[21] M.Ichige, Y.Takeuchi, K.Sugimae, A.Sato, M.Matsui, T.Kamigaki, H.Kutsukake, Y.Ishibashi, M.Saito, S.Mori, H.Meguro, S.Miyazaki, T.Miwa, S.Takahashi, T.Iguchi, N.Kawai, S.Tamon, N.Arai, H.Kamata, T.Minami, H.Iizuka, M.Higashitani, T.Pham, G.Hemink, M.Momodomi and R.Shirota, “A novel self-aligned shallow trench isolation cell for 90nm 4Gbit NAND Flash EEPROMs,” in Symp. VLSI technologies Dig. Tech. Papers, pp.89-90, June 2003.

 

[22] T.Tanaka, M.Momodomi, Y.Iwata, Y.Tanaka, H.Oodaira, Y.Itoh, R.Shirota, K.Ohuchi, and F.Masuoka, “A 4-Mbit NAND-EEPROM with tight programmed Vt distribution,” in Symp. VLSI Circuits Dig. Tech. Papers, pp.105-106, June 1990.

[23] T.Tanaka, Y.Tanaka, H.Nakamura, H.Oodaira, S.Aritome, R.Shirota, and F.Masuoka, “A Quick Intelligent Page-Programming Architecture 3V-Only NAND- EEPROMs,” in Symp. VLSI Circuits Dig. Tech. Papers, pp.20-21, June 1992.

[24] T.Tanzawa, T.Tanaka, K.Takeuchi, R.Shirota, S.Aritome, H.Watanabe, G.Hemink, K.Shimizu, S.Sato, Y.Takeuchi, and K.Ohuchi, “A compact on-chip ECC for low cost Flash memories,” in Symp. VLSI Circuits Dig. Tech. Papers, pp.59-60, June 1996.

 

[25] M.Momodomi, Y.Iwata, T.Tanaka, Y.Ithoh, R.Shirota, F.Masuoka, “A high density NAND EEPROM with Block-page Programming for Micorcomputer Applications”, in IEEE CICC, pp.10.1.1-4, May, 1989.

 

[26] S.Aritome, R.Kirisawa, T.Endoh, N.Nakayama, R.Shirota, K.Sakui, K.Ohuchi, and F.Masuoka, “Extended Data Retention Characteristics after more than 104 Write and Erase Cycles in EEPROM’s,” in IEEE IRPS 1990, pp.259-264, 1990.

[27] S.Aritome, K.Hatakeyama, T.Endoh, T.Yamaguchi, S.Shuto, H.Iizuka, T.Maruyama, H.Watanabe, G.J.Hemink, T.Tanaka, M.Momodomi, K.Sakui, and R.Shirota, “A 1.13mm² memory cell technology for reliable 3.3V 64M NAND EEPROMs,” in Extended Abstracts of SSDM, pp.446-448, Aug.1993.

[28] M.Momodomi, R.Shirota, K.Sakui, T.Endoh, and F.Masuoka, “Trend of NAND Flash memory and future development,” in International Workshop on Advanced LSI’s, pp.219-225, July 1995.

[29] K.Sakui, T.Tanaka, H.Nakamura, M.Momodomi, T.Endoh, R.Shirota, S.Watanabe, K.Ohuchi, and F.Masuoka, “A shielded bitline sensing technology for a high-density and low-voltage NAND EEPROM design,” in International Workshop on Advanced LSI’s, pp.226-232, July 1995.

[30] K.Sakui, Y.Itoh, R.Shirota, Y.Iwata, S.Aritome, T.Tanaka, K.Imamiya, J.Kishida, M.Momodomi, and J.Miyamoto, “Invited Paper: NAND Flash memory technology and future direction,” in IEEE 1997 NVSMW, pp.1-34, Feb. 1997.

[31] F.Arai, T.Maruyama and R.Shirota, “Extended Data Retention Process Tcdhnology for Highly Reliable Flash EEPROMs of 10⁶ to 10⁷ W/E Cycles”, in IEEE IRPS 1998, pp.378-382, April 1998.

[32] R.Shirota, “Invited paper: A Review of 256Mbit NAND Flash Memories and NAND Flash Future Trend.” in Non-Volatile Semiconductor Memory Workshop, pp.22-32, Feb.2000.

[33] R.Shirota, “Test and repair of non-volatile commodity and embedded memories (NAND flash memory) “ in IEEE test Conference, pp.1221,Oct. 2002

[34] R.Shirota, “Invited paper:Future Trends in NAND-Type Flash Memory,” in Extended Abstracts of SSDM, pp.250-251, Aug.2004.

[35] R.Shirota, “Review of NAND Flash reliability,” in IEEE IRPS Tutorial notes, No.223, April 2005.

[36] R.Shirota, “NAND Flash Scaling and Technology Development” in Japan Semiconductor Technology Forum”, Jan. 2006.

[37] R.Shirota, “ Roadmap of the Flash Memory”, IEEE International Workshop on Digital Object Identifier in Memory Technology, Design, and Testing, MTDT, pp: xii – xii, Jun. 2006

[38] BREAKTHROUGH---Memory of the Future, The JAPAN, Journal, August, 2006

[39] R.Shirota, “Scaling trend of Flash memory for File storage”, in Memory, Tech, Design, Testing Workshop, pp.16, 2007.

[40] R.Shirota, “Review of recent development of high density Flash memory”, in New Non-Volatile Memory Workshop at ITRI, session B1, Nov. 2008.

[41] Hsin-Heng Wang, Chiu-Tsung Huang, Shin-Hsien Chen, Kuo, R, Sophia Liu, Ling-Kuey Yang, Houng-Chi Wei, Pittikoun, S., R.Shirota, Chin-chen Cho, ”A Study of Slow Erasing Speed at Edge Cell in Nano-Scale NAND Flash Memory”, in VLSI-TSA International Symposium, pp.87 – 88, 2008.

[42] R.Shirota, “Review of Recent Flash Memory Development”, in Symposium on Nano Device Technology, Session 1.2, Apr. 2010.

[43] C.H.Liu, Y.M.Lin, R.Shirota, H.C.Wei, L.T.Kuo, C.Han.Liu, S.H.Chen, H.P.Wang, Y.Sakamoto, S.Pittikoun, “Self-Aligned Trench Isolation Recess Effect on Cell Performance and Reliability of 42nm NAND Flash Memory”, in VLSI-TSA, Session 3.1, Apr. 2010.

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