年度 2020
全部作者 李育民
论文名称 Ming-Yu Huang, Hung-Ming Chen, Kuan-Neng Chen, Shih-Hsieh Wu, Yu-Min Lee, and An-Yu Su, “A design flow for micro bump and stripe planning on modern chip-package co-design,” in The Electronic Components and Technology Conference (ECTC), 2020.
语言 中文