年度	2023
全部作者	李育民,Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan
论文名称	Chiplet placement for 2.5D IC with sequence pair based tree and thermal consideration
会议名称	to appear in Asia South Pacific Design Automation Conference (ASPDAC 2023)
地点	Japan
会议期间	2023/01/16-19
语言	英文