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Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology, and Chair Professor of Department of Electronics Engineering in National Yang Ming Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards (5 times), CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 6 book chapters, and holds 83 patents. He was Guest Editor of IEEE Transactions on Components, Packaging, and Manufacturing Technology, and MRS Bulletin. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, and IET, and a member of Phi Tau Phi Scholastic Honor Society.
In addition to his faculty position, Dr. Chen is currently Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.