李育民
副教授
姓名 李育民
職稱 副教授
電子郵件 yumin@nctu.edu.tw
聯絡電話 03-513-1274
網站 http://vlsi-eda.cm.nctu.edu.tw/yumin/
教授簡介 Yu-Min Lee received the B.S. and M.S. degrees in communication engineering from the National Chiao-Tung University, Taiwan, in 1991 and 1993, respectively, and the Ph.D. degree in electrical and computer engineering from the University of Wisconsin-Madison in 2003. In 2003, he joined the Faculty of National Chiao Tung University, Hsinchu, Taiwan, where he currently holds a position as Associate Professor in the Department of Electrical and Computer Engineering.His research interests include computer-aided design on VLSI circuits with emphases on interconnect analysis and optimization, and circuit/thermal/electro-thermal simulation. Dr. Lee is a recipient of the ISPD Best Paper Award in 2003 and the ASP-DAC Best Papaer Award in 2013.
研究專長 VLSI設計自動化
年度 論文名稱
2017 Yu-Min Lee and Chia-Tung Ho, “InTraSim: Incremental Transient Simulation of Power Grids,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 36, no. 12, pp 2052~2065, December 2017.
2017 Yu-Min Lee, Kuan-Te Pan, and Chun Chen, “NaPer: A TSV Noise-Aware Placer,” IEEE Transactions on Very Large Scale Integration Systems (TVLSI), vol.25, no. 5, pp. 1703~1713, May 2017.
2016 Pei-Yu Huang and Yu-Min Lee, "Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms", IEEE Transactions on Very Large Scale Integration Systems (TVLSI), vol. 17, no. 5, pp. 613~626 , 2009.
2016 Hong-Wen Chiou, Yu-Min Lee, “Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs,” Journal of Computer and Communications, vol. 4, no. 15, pp. 33~45, November 2016.
2015 Yu-Min Lee, Chi-Wen Pan, Pei-Yu Huang, and Chi-Ping Yang, "LUTSim: A Look-Up Table Based Thermal Simulator for 3-D ICs," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 34, no. 8, pp. 1250~1263, August 2015.
2015 Pei-Yu Huang and Yu-Min Lee, “An Efficient Method for Analyzing the On-Chip Thermal Reliability with Considering Process Variations,” ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 18, no. 2, article no. 41, July 2013.
2015 Ta-Sung Lee, Yu-min Lee, "Phase Coherent Blind Equalization for High Order QAM Signals", Journal of the Chinese Institute of Electrical Engineering, vol.1, no.1, 1994.
2015 Yu-Min Lee and Charlie Chung-Ping Chen, "Power Grid Transient Simulation in Linear Time Based on Transmission-Line-Modeling Alternating-Direction-Implicit Method", IEEE Trans. Computer-Aided Design of Integrated Circuits And Systems (TCAD), Vol. 21, No. 11, pp. 1343 -1352, 2002.
2015 Yu-Min Lee, Charlie Chung-Ping Chen, and D. F. Wong, "Optimal Wire-sizing Function under the Elmore Delay Model with Bounded Wiresizes", IEEE Trans. Circuits & Systems-I (TCAS-I) Vol. 49, No. 11, pp. 1671--1677, 2002.
2015 Yu-Min Lee, Charlie Chung-Ping Chen, Yao-Wen Chang, and D. F. Wong, "Simultaneous Buffer-sizing and Wire-sizing for Clock Trees Based on Lagrangian Relaxation", VLSI Design Journal, vol. 15, no. 3, pp. 587-594, 2002.
2015 Yu-Min Lee and Charlie Chung-Ping Chen, "The Power Grid Transient Simulation in Linear Time Based on 3D Alternating-Direction-Implicit Method", IEEE Trans. Computer-Aided Design of Integrated Circuits And Systems (TCAD), Vol. 22, No. 11, pp. 1545-1550, 2003.
2015 Yu-Min Lee, Yahong Cao, Tsung-Hao Chen, Janet Wang, and Charlie Chung-Ping Chen, "HiPRIME: Hierarchical and Passivity Preserved Interconnect Macromodeling Engine for RLKC Power Delivery", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 24, no. 6, pp. 797~806, 2005.
2015 Yu-Min Lee and Po-Yi Chiang, “Effective Sleep Transistor Sizing Algorithm for Leakage Power Reduction,” International Journal of Electrical Engineering (IJEE), vol. 16, no. 5, pp. 421-431, October 2009.
2015 Yu-Min Lee and Chi-Wen Pan, “Redundant Via Insertion with Wire Spreading Capability,” International Journal of Electrical Engineering (IJEE), vol. 17, no. 6, pp. 383-398, December 2010.
年度 論文名稱
2021 Yu-Min Lee, Wen-Sheng Lo, Hong-Wen Chiou, and Shih-Chieh Hsu, DLAG-TA: Deep Learning-Based Adaptive Grid Builder for System-Level Thermal Analysis, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), USA, , 2021-06-01-2021-06-04
2021 Guan-Jia Chen, Hong-Wen Ciou, Yu-Teng Chang, Yu-Min Lee, Thermal Pad Design Flow for Automotive Electronics, IEEE International Conference on Consumer Electronics - Taiwan (IEEE 2021 ICCE-TW), Penghu Taiwan, , 2021-06-16-2021-06-18
2020 Chi-Hsien Pao, Yu-Min Lee, An-Yu Su, “An XGBoost-based IR Drop Predictor for Power Delivery Network,” in The Design, Automation, and Test in Europe Conference (DATE), 2020.
2020 Ming-Yu Huang, Hung-Ming Chen, Kuan-Neng Chen, Shih-Hsieh Wu, Yu-Min Lee, and An-Yu Su, “A design flow for micro bump and stripe planning on modern chip-package co-design,” in The Electronic Components and Technology Conference (ECTC), 2020.
2020 Hong-Wen Chiou, Yu-Min Lee, Shen-Chung Hsu, Guan-Jia Chen, Chi-Wen Pan, and Tai-Yu Chen, “Temperature-to-power mapping for smartphones,” in The Intersociety Conference on Thermal and Theromechanical Phenomena in Electronic System (ITherm), 2020.
2020 Wen-Sheng Lo, Shih-Chieh Hsu, Hong-Wen Chiou, Yu-Min Lee, Liang-Chia Cheng, “DLAG-TA: Deep Learning-Based Adaptive Grid Predictor for System-Level Thermal Analysis,” in Design Automation Conference, Work-in-Progress Poster Session (DAC-WIP), 2020.
2020 Yu-Min Lee, Chi-Wen Pan, Li-Rui Jo, and Hong-Wen Chiou, “FasThermSim: Fast and accurate thermal simulations from chiplets to system,” in The University Booth at The Design, Automation, and Test in Europe Conference (DATE), 2020.
2019 Hsuan-Hsuan Hsiao, Hong-Wen Chiou, Yu-Min Lee, “Multi-angle bended heat pipe design using X-architecture routing with dynamic thermal weight on mobile devices,” in Asia South Pacific Design Automation Conference (ASPDAC), 2019.
2019 Hong-Wen Chiou, Yu-Min Lee, Shin-Yu Shiau, Chi-Wen Pan, Tai-Yu Chen, “Phone-nomenon: A system-level thermal simulator for handheld devices,” in Asia South Pacific Design Automation Conference (ASPDAC), 2019. (Best Paper Nominee)
2019 Wen-Sheng Lo, Hong-Wen Chiou, Shih-Chieh Hsu, Yu-Min Lee, and Liang-Chia Cheng, “Learning based mesh generation for thermal simulation in handheld devices with variable power consumption,” in The Intersociety Conference on Thermal and Theromechanical Phenomena in Electronic System (ITherm), 2019.
2018 Jui-Hung Wang, Yu-Min Lee, Hsuan-Hsuan Hsiao, and Liang-Chia Cheng, “A system-level thermal simulator with automatic meshing techniques,” in The Intersociety Conference on Thermal and Theromechanical Phenomena in Electronic System (ITherm), 2018.
2017 Hong-Wen Chiou, Yu-Min Lee, Hsuan-Hsuan Hsiao, Liang-Chia Cheng, “Thermal modeling and design on smartphones with heat pipe cooling technique,” in International Conference on Computer Aided Design (ICCAD), 2017.
2017 Yu-Min Lee, Chi-Han Lee, Yan-Cheng Zhu, “Yield-Driven Redundant Power Bump Assignment for Power Network Robustness,” in Asia South Pacific Design Automation Conference (ASPDAC), 2017.
2017 Hong-Wen Chiou, Yu-Min Lee, Liang-Chia Cheng, Wei-Hung Lee, “Thermal Modeling and Design for Heat Pipe in High-End Smartphones,” Design Automation Conference, Work-in-Progress Poster Session (DAC-WIP), 2017.
2016 Hong-Wen Chiou, Yu-Min Lee, “Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs,” in International Conference on Computer Simulation, Graphics and Aided Design (CSGAD), 2016.
2015 Yu-Min Lee, Chun Chen, JiaXing Song, Kuan-Te Pan, “A TSV Noise-Aware 3-D Placer,” in The Design, Automation, and Test in Eurpoe Conference (DATE), 2015.
2015 JiaXing Song, Yu-Min Lee, Chia-Hung Ho, “ThermPL: Thermal-aware Placement Based on Thermal Contribution and Locality,” in International Symposium on VLSI Design and Test (VLSI-DAT), 2016.
2015 Best Paper Award)." target='_blank'>Ting-Yuan Wang, Yu-Min Lee, and Charlie Chung-Ping Chen, "3D Thermal-ADI: an efficient chip-level transient thermal simulator", International Symposium on Physical Design (ISPD) 2003 (Best Paper Award).
2015 Best Paper Award)" target='_blank'>Chi-Wen Pan, Yu-Min Lee, Pei-Yu Huang, Chi-Ping Yang, Chang-Tzu Lin, Chia-Hsin Lee, Yung-Fa Chou, Ding-Ming Kwai, "I-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICs," in Asia South Pacific Design Automation Conference (ASPDAC), 2013. (Best Paper Award)
2015 invited)" target='_blank'>Chia-Tung Ho, Yu-Min Lee, “Efficient Transient Incremental Analysis of On-Chip Power Grid,” in Asia-Pacific Radio Science Conference (AP-RASC), 2013. (invited)
2015 Yu-Min Lee, Charlie Chung-Ping Chen, "The power grid transient simulation in linear time based on 3D alternating-direction-implicit method", Design, Automation and Test in Europe (DATE) 2003.
2015 Yu-Min Lee, Charlie Chung-Ping Chen, "A hierarchical analysis methodology for chip-level power delivery with realizable model reduction", Asia South Pacific Design Automation Conference (ASPDAC) 2003.
2015 Yahong Cao, Yu-Min Lee, Tsung-Hao Chen, and Charlie Chung-Ping Chen, "HiPRIME: Hierarchical and passivity reserved interconnect macromodeling engine for RLKC power delivery", Design Automation Conference (DAC) 2002.
2015 Yu-Min Lee, Hing Yin Lai, Charlie Chung-Ping Chen, "Optimal spacing and capacitance padding for general clock struct", Asia South Pacific Design Automation Conference (ASPDAC) 2001.
2015 Saisanthosh Balakrishnan, Jong Hyuk Park, Hyungsuk Kim, Yu-Min Lee, and Charlie Chung-Ping Chen, "Linear time hierarchical capacitance extraction without multiple expansion", International Conference on Computer Design (ICCD) 2001.
2015 Yu-Min Lee, Charlie Chung-Ping Chen, "Power grid transient simulation in linear time based on transmission-line-modeling alternating-direction-implicit method", International Conference on Computer Aided Design (ICCAD) 2001.
2015 Pei-Yu Huang,Yu-Min Lee, Jeng-Liang Tsai, and Charlie Chung-Ping Chen, "Simultaneous area minimization and decaps insertion for power delivery network using adjoint sensitivity analysis with IEKS method," International Symposium on Circuits and Systems (ISCAS) 2006.
2015 Yih-Lang Lin, Chih-Hong Hwang, and Yu-Min Lee, "Performance- and congestion-driven multilevel router," 13th Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI) 2006.
2015 Cheng-Hsuan Chiu, Yu-Chan Chang, Pei-Yu Huang, Chih-Hong Hwang, and Yu-Min Lee, "Crosstalk-driven slacement with considering on-chip mutual inductance and RLC noise", 13th Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI) 2006.
2015 Yu-Min Lee, Huan-Yu Chou, and Pei-Yu Huang, "An aggregation-based algebraic multigrid method for power grid analysis," 8th International Symposium on Quality Electronic Design (ISQED) 2007.
2015 Pei-Yu Huang, Chih-Kang Lin and Yu-Min Lee, "Hierarchical power delivery network analysis using Markov Chains," IEEE International SOC Conference (SOCC) 2007.
2015 Yu-Min Lee, Charlie Chung-Ping Chen, "The power grid transient simulation in linear time based on 3D alternating-direction-implicit method", Progress In Electromagnetics Research Symposium (PIERS) 2003.
2015 Pei-Yu Huang, Chih-Kang Lin, and Yu-Min Lee, "Full-chip thermal analysis for the early design stage via generalized integral transforms," Asia South Pacific Design Automation Conference (ASPDAC) 2008.
2015 Pei-Yu Huang, Jia-Hong Wu and Yu-Min Lee, "Stochastic thermal simulation considering spatial correlated within-die process variations," Asia South Pacific Design Automation Conference (ASPDAC) 2009.
2015 Shih-An Yu, Pei-Yu Huang and Yu-Min Lee, "A multiple supply voltage based power reduction method in 3-D ICs considering process variations and thermal effects," Asia South Pacific Design Automation Conference (ASPDAC) 2009.
2015 Cheok-Kei Lei, Po-Yi Chiang and Yu-Min Lee, "Post-routing redundant via insertion with wire spreading capability," Asia South Pacific Design Automation Conference (ASPDAC) 2009.
2015 Jin-Tai Yan, Zhi-Wei Chen, Bo-Yi Chiang and Yu-Min Lee, "Timing-constrained yield-driven redundant via insertion," in Asia Pacific Conference on Circuits and Systems (APCCAS) 2008.
2015 Yu-Min Lee, Tsung-You Wu, and Po-Yi Chiang, “A Hierarchical Bin-Based Legalizer for Standard-Cell Designs with Minimal Disturbance,” Asia South Pacific Design Automation Conference (ASPDAC) 2010.
2015 Shu-Han Wei, Bing-Shiun Su, Yu-Min Lee, and Chi-Wen Pan, “Spatial Correlation Extraction with a Limit Amount Measurement Data,” in Asia Symposium on Quality Electronic Design (ASQED) 2010.
2015 Huai-Chung Chang, Pei-Yu Huang, Ting-Jung Li, and Yu-Min Lee, “Statistical Electro-Thermal Analysis with High Compatibility of Leakage Power Models,” International SoC Conference (SOCC) 2010
2015 Chia Tung Ho, Yu-Min Lee, Shu-Han Wei, Liang-Chia Cheng, “Incremental Transient Simulation of Power Grid,”in International Symposium on Physical Design (ISPD), 2014.
2015 Yu-Min Lee, Charlie Chung-Ping Chen “Hierarchical model order reduction for signal-integrity driven interconnect synthesis”, Proceedings of the 11th Great Lakes Symposium on VLSI, pp. 109-114, 2001.
2015 Simon Yi-Hung Chen, Zhe-Yu Lin ,Yu-Min Lee, “LPGC : A Novel Low Power Driven Placement Algorithm Based on Optimal Gated Clock Topology” in Proceedings of the 16th VLSI Design/CAD Symposium, 2005.
2015 Huan-Yu Chou and Yu-Min Lee, “An Aggregation-Based Algebraic Multigrid Method with Application to On-Chip Power Network Analysis” in Proceedings of the 16th VLSI Design/CAD Symposium, 2006.
2015 Pei-Yu Huang, Chih-Kang Lin, and Yu-Min Lee, “Full-Chip Thermal Analysis via Generalized Integral Transforms,” the 14th Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI), 2007.
2015 Cheok-Kei Lei, Bo-Yi Chiang and Yu-Min Lee, “An efficient redundant via insertion with wire pushing capability,” in Proceedings of the 19th VLSI Design/CAD Symposium, 2008.
2015 Shih-An Yu, Pei-Yu Huang and Yu-Min Lee, “Power optimization in 3D ICs considering process variations and thermal effect,” in Proceedings of the 19th VLSI Design/CAD Symposium, 2008.
2015 Pei-Yu Huang, Jia-Hong Wu, Yu-Min Lee, and Huai-Chung Chang, “Stochastic thermal simulation considering with-in die process variations,” in Proceedings of the 19th VLSI Design/CAD Symposium, 2008.
2015 Tsung-You Wu and Yu-Min Lee, “Fast Legalize: legalization with minimal disturbance for standard cell design,” in Proceedings of the 20th VLSI Design/CAD Symposium, 2009.
2015 Chi-Wen Pan and Yu-Min Lee, “Redundant via insertion under timing constraints,” in International Symposium on Quality Electronic Design (ISQED), 2011.
2015 Shu-Han Wei and Yu-Min Lee, “Supply Voltage Assignment for Power Reduction in 3D ICs Consudering Thermal Effect and Level Shifter Budget,” in International Symposium on VLSI Design and Test (VLSI-DAT), 2011.
2015 Pei-Yu Huang, Yu-Min Lee, and Chi-Wen Pan “On-Chip Statistical Hot-Spot Estimation Using Mixed-Mesh Statistical Polynomial Expressing Generating and Skew-Normal Based Moment Matching Techniques,” in Asia South Pacific Design automation Conference (ASPDAC), 2012.
2015 Yi-Hsuan Lee, Yu-Min Lee, Liang-Chia Cheng, Yen-Tang Chang, "A Robust Incremental Power Grid Analyzer by Macromodeling Approach and Orthogonal Matching Pursuit," Asia Symposium on Quality Electronic Design (ASQED), 2012.
2015 Yu-Min Lee, Tsung-Heng Wy, Pei-Yu Huang, Chi-Ping Yang, "NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs," in The Design, Automation, and Test in Eurpoe Conference (DATE), 2013.
2015 Shu-Han Wei, Yu-Min Lee, Chia-Hung Ho, Chih-Ting Sun, Liang-Chia Cheng, “Power Delivery Network Design for Wiring and TSV Resource Minimization in TSV-Based 3-D ICs,” in International Symposium on VLSI Design and Test (VLSI-DAT), 2013.
2015 Chi-Wen Pan, Hung-Wen Chiou, Yu-Min Lee, Tai-Yu Chen, Sheng-Liang Li, Wen-Sung Hsu, Tao Cheng, “Phone-Nomenon: A System-Level Thermal Simulator for Smartphones,” Design Automation Conference, Work-in-Progress Poster Session (DAC-WIP), 2015.
計畫類別 年度 計畫名稱 參與人 職稱/擔任之工作 計畫期間 補助/委託或合作機構
研究計畫 2019 Automatic Mesh Generation for Thermal Analysis in Handheld Devices Yu-Min Lee Principal Investigator 2019.08 ~ 2021.07 MOST
研究計畫 2018 Thermal Modeling and Design for Multi-Angle Bended and Multiple Heatpipes Yu-Min Lee Principal Investigator 2018.08 ~ 2019.07 MOST
產學合作計畫 2017 Thermal Modeling and Analysisfor Handheld Devices 李育民 Principal Investigator 2017.01 ~ 2017.12 聯發科
產學合作計畫 2017 在ELS層級評估功率與效能對軟硬體架構決策之影響 (III) 李育民 主持人 2017.01 ~ 2017.12 工研院
研究計畫 2016 良率驅動之晶片電源供應網路冗餘電源墊指派法 李育民 主持人 2016.08 ~ 2017.07 科技部
產學合作計畫 2016 在ELS層級評估功率與效能對軟硬體架構決策之影響 (II) 李育民 主持人 2016.01 ~ 2016.12 工研院
產學合作計畫 2016 手持式裝置熱模擬技術 (II) 李育民 主持人 2015.08 ~ 2016.12 聯發科
產學合作計畫 2015 在ELS層級評估功率與效能對軟硬體架構決策之影響 (I) 李育民 主持人 2015.01 ~ 2016.12 工研院
研究計畫 2014 三維積體電路電源供應網路診斷與修復技術(I) 李育民 主持人 2014.08 ~ 2015.07 科技部
產學合作計畫 2014 手持式裝置熱模擬技術 (I) 李育民 主持人 2014.08 ~ 2015.07 聯發科
研究計畫 2013 考量先進散熱技術的三維度積體電路熱分析法 李育民 主持人 2013.08 ~ 2014.07 科技部
產學合作計畫 2013 三維積體電路電源供應網路診斷技術 李育民 主持人 2013.01 ~ 2013.12 工研院
產學合作計畫 2013 Prediction in Package Warpage 李育民 主持人 2012.09 ~ 2013.08 矽品精密工業股份有限公司
研究計畫 2012 適用於平行計算的三維度積體電路熱分析技術 (II) 李育民 主持人 2012.08 ~ 2013.07 國科會
產學合作計畫 2012 小型車用基本晶片內部層級EMI模型分析及模擬研究委辦計畫 李育民 共同主持人 2012.02 ~ 2012.11 經濟部標準檢驗局
產學合作計畫 2012 3-D IC電源供應網路設計 李育民 主持人 2012.01 ~ 2012.12 工研院
產學合作計畫 2012 開發晶片層級溫度分析模型與工具 李育民 主持人 2012.01 ~ 2012.12 工研院
研究計畫 2011 適用於平行計算的三維度積體電路熱分析技術 (I) 李育民 主持人 2011.08 ~ 2012.07 國科會
產學合作計畫 2011 適用於三維度積體電路自動設計化開發平台的熱分析技術 李育民 主持人 2011.01 ~ 2011.12 工研院
產學合作計畫 2011 3-D IC電源供應網路設計 李育民 主持人 2011.01 ~ 2011.12 工研院
研究計畫 2010 三維度積體電路的隨機電熱模擬及其對功率最佳化的應用 (2/2) 李育民 主持人 2010.08 ~ 2011.07 國科會
產學合作計畫 2010 考慮TSV/TTSV效應之三維度積體電路快速熱遷徙分析技術 李育民 主持人 2010.01 ~ 2010.12 工研院
研究計畫 2009 三維度積體電路的隨機電熱模擬及其對功率最佳化的應用 李育民 主持人 2009.08 ~ 2010.07 國科會
研究計畫 2008 先進製程技術之設計與可靠度提昇研究--子計畫二：考慮製程變異的導線模型、時序分析以及最佳化(3/3) 李育民 主持人 2008.08 ~ 2009.07 國科會
產學合作計畫 2008 Net Delay Analysis 李育民 主持人 2008.07 ~ 2009.07 思源科技
研究計畫 2007 單晶片系統驗證之核心技術開發-子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(3/3) 李育民 主持人 2007.08 ~ 2008.07 國科會
研究計畫 2007 先進製程技術之設計與可靠度提昇研究-子計畫二：考慮製程變異的導線模型、時序分析以及最佳化(2/3) 李育民 主持人 2007.08 ~ 2008.07 國科會
研究計畫 2006 單晶片系統驗證之核心技術開發--子計畫六：針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(2/3) 李育民 主持人 2006.08 ~ 2007.07 國科會
研究計畫 2006 先進製程技術之設計與可靠度提昇研究--子計畫二：考慮製程變異的導線模型、時序分析以及最佳化(1/3) 李育民 主持人 2006.08 ~ 2007.07 國科會
研究計畫 2005 低功率系統之設計及自動化：子計劃九-適用於晶片上電力傳輸分析之階層模組簡化技術(3/3) 李育民 主持人 2005.08 ~ 2006.07 國科會
研究計畫 2005 單晶片系統驗證之核心技術開發：子計畫六-針對先進晶片設計的熱點驗證之完整熱模型與高效能熱分析(1/3) 李育民 主持人 2005.08 ~ 2006.07 國科會
研究計畫 2004 低功率系統之設計及自動化：子計劃九-適用於晶片上電力傳輸分析之階層模組簡化技術(2/3) 李育民 主持人 2004.08 ~ 2005.07 國科會
研究計畫 2003 低功率系統之設計及自動化：子計劃九-適用於晶片上電力傳輸分析之階層模組簡化技術(1/3) 李育民 主持人 2003.11 ~ 2004.07 國科會
年度 實驗室名稱 位置
電子設計自動化實驗室 工四館718
國家 學校名稱 系所 學位 期間
USA University of Wisconsin-Madison　 Electrical and Computer Engineering　 Ph.D 1997.09 ~ 2003.08
TAIWAN National Chiao Tung University　 Communication Engineering　 M.S 1991.09 ~ 1993.06
TAIWAN　 National Chiao Tung University　 Communication Engineering　 B.S. 1987.09 ~ 1991.06
服務機關名稱 職務 期間
Intel Corp., Austin, Texas　 Summer Intern　 2001.06 ~ 2001.09
ZyXEL Communications Corp., Hsinchu, Taiwan　 Senior Engineer　 1995.06 ~ 1995.12
類別 年度 獎項名稱 頒獎單位
校外榮譽事項 2013 ASPDAC 2013 Best Paper Award IEEE/ACM
校外榮譽事項 2013 指導研究生潘麒文、楊啟平榮獲2013國際積體電路電腦輔助設計(CAD)軟體製作競賽馬拉松組國內選拔 佳作
校外榮譽事項 2009 指導研究生黃培育、潘麒文、李亭蓉 榮獲大學院校奈米元件電腦輔助模擬與設計軟體製作競賽 奈米CMOS元件組 佳作 國家實驗研究院國家奈米元件實驗室
校內榮譽事項 2008 96 學年度績優導師獎 交通大學
校外榮譽事項 2007 指導研究生吳佳鴻、李庚達榮獲九十五學年度大學校院積體電路電腦輔助設計軟體製作競賽 實體設計組 特優 教育部
校外榮譽事項 2003 ISPD 2003 Best Paper Award IEEE/ACM/SIGDA